3C Electronic & Semiconductor Industry

  • ·Components Management Challenges:

    Production workshops are expansive, and components are dispersed, making inventory management and logistics highly complex.

  • ·Flexible Manufacturing Processes:

    Products are highly customized, with numerous categories and frequent upgrades, requiring high equipment flexibility.

  • ·Labor Challenges:

    High work intensity, recruitment difficulties, high employee turnover, and elevated labor costs.

  • ·Cleanliness Requirements:

    Certain cleanliness standards must be maintained.

  • ·Fragile Components:

    Costly and delicate components require stringent anti-vibration measures during transfer, placing high demands on the stability and precision of robots.

  • ·Complex On-site Conditions:

    Environment involves human-robot interactions, frequent changes in products and substantial external interference, posing challenges to seamless operations.

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Case Study· 3C & Semiconductor Industry

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